Copper Spring Clip for the Electronics Industry

Copper Spring Clip for the Electronics IndustryWorking in beryllium copper (BeCu) alloy C172, CGR Technologies Inc. manufactures a spring clip used in the electronics industry. The beryllium copper C172 base material is tempered to ¼ HT, and is age hardened. The client's design required a flat spring mechanism, which we designed and built with dimensions of 0.350" in length, and 0.200" in width, with a 0.012" material thickness.

The flat blanks were made using the photo etching process. We formed the spring clip using our proprietary stage tooling, enabling us to maintain a tolerance of +/- 0.003". After forming the product was precipitation hardened for 2 hours at 600 degrees F, and in addition to heat treating, a final plating process of plating bright tin over ductile nickel is applied. This was a 500 piece prototype order, delivered in 2 weeks to the customer.

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Copper Spring Clip for the Electronics Industry

Specifications

Capabilities Applied/Processes Photo-etching, chemical milling, forming, heat treating, plating
Tightest Tolerance +/- .003"
Material Thickness .012"
Product Length .350
Product Width .200
Product Height .200
Base Material c172 BeCu ¼ ht, beryllium copper
Material Thickness Applied Bright Tin over Ductile Nickel
Special Feature Flat Spring
Industry for Use Electronics
Volume 500 pieces
Delivery Time 2 weeks
Project Scope Design and Build
Design Work Tooling and fixturing
Drawing Type Accepted Iges, Step, DXF, DWG, Parasolid, X_T, Pro/E, SolidWorks, PDF, tif, jpg

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CGR Technologies Inc.